ROHS PC JEDEC Matrix Tray For IC Device 0.76mm Flatness

The JEDEC matrix tray is mainly used for chip packaging testing in the semiconductor industry.Because IC chips are tiny and thin, they are extremely vulnerable to damage during storage and transportation. So customers often use the JEDEC tray for packaging protection. It is a standard tray used to transport, store and pack the electronic components. The products not only comply with JEDEC international standards and ROHS environmental protection standards, but also fully meet the packaging requirements of various chips. We can customize the perfect tray according to customers' requirements.

The Details of the HN22009 JEDEC Matrix Tray

The JEDEC trays have the same outline size of 12.7 inches * 5.35 inches (322.6 mm * 135.89 mm),HN22009 is made primarily of PC materials with excellent strength, flame retardant and many other properties. It not only can prevent external damage to customers' products, but also do not pollute the environment.

At the same time, 3*8 matrix pockets are distributed inside the tray. The spacing between the pockets also allows the automation equipment to locate the product more accurately. The tray is not only small in size and light in weight, its warping degree is less than 0.76mm to perfect stacking. Thus it can greatly reduce the customer's transportation and storage costs.

Application The HN22009 JEDEC Tray

Electronic Component Test and Measurement Technology
Military Industry Power Supply

Our Service

1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4.After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

FAQ

Q1: Are You Manufacturer or Trade Company?

Ans: We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2:What is the material of your product?

Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Ans: Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get quotation of the custom products ?

Ans: Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Ans:Yes, the free sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Ans:Yes, we can put your logo on our products, show us your logo firstly please.

Q7: When can we get the samples?
Ans: We can send you them right now if you are interested in something we have stock, and customize, the project depending on the interested.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/