Heat Resistant PES Black JEDEC Trays For IC Chip SGS Certified

Our JEDEC tray series is tailored for QFP, BGA, and other IC packages, ensuring secure positioning during high-speed processes.

HN21090 is a kind of high-temperature resistant IC tray made of PES and the injection molding process. The JEDEC tray is a carrier used by semiconductor chip companies for packaging and baking tests of their chips. Because the tray can be in a 120℃-220℃ different bake environment without deformation characteristics, it is commonly known as 'high temperature tray' in the electronics industry.

Details about The HN21090 Heat Resistant PES Black JEDEC Trays For IC Chip

The JEDEC tray has good heat resistance and can be used continuously at temperatures of 180°C to 200°C. In the temperature range below 180°C, its melting resistance is one of the most excellent thermoplastic resins. At the same time, in terms of environmental protection and health, it meets the requirements of ROHS and halogen-free environmental protection. The 18*8 matrix can also load more products, which greatly reduces the transportation cost for customers.

Application:

Electronic Component, Embedded System, Sensor, Test and Measurement Technology

Technical Parameters:

Advantages:

1. Lightweight, saving transportation and packaging costs;
2. Good anti-static performance, effectively ensures that the product is not damaged by anti-static release;
3. High temperature resistance, suitable for high temperature automation equipment assembly;
4. Corrosion resistance, suitable for all kinds of production conditions of products;
5. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, and cost saving.
6. Edge chamfer design effectively prevents stacking errors and corrects the direction of placement.

FAQ:

Q1: Are you a manufacturer?
Ans: Yes, we are a 100% manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity, and size normally.

Q3: How long could you prepare samples?
Ans: Normally, 3 days. If customized, open a new mold 25~30 days around.
Q4: How about batch order production?
Ans: Normally 5- 8 working days or so.
Q5: Do you inspect the finished products?
Ans: Yes, we will inspect according to the ISO 9000 standard and be ruled by our QC staff.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/