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ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC

Shenzhen Hiner Technology Co., Ltd.
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    Buy cheap ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC from wholesalers
     
    Buy cheap ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC from wholesalers
    • Buy cheap ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC from wholesalers
    • Buy cheap ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC from wholesalers
    • Buy cheap ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC from wholesalers

    ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC

    Ask Lasest Price
    Brand Name : Hiner-pack
    Model Number : 3 Inch Series
    Certification : ISO 9001 ROHS SGS
    Price : $0.35~$0.85(Prices are determined according to different incoterms and quantities)
    Payment Terms : T/T
    Supply Ability : 3800PCS~4000PCS/per day
    Delivery Time : 5~8 working days
    • Product Details
    • Company Profile

    ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC

    ODM Anti Static Bare Die Trays CSP Chip Scale Package Transporting IC


    Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package


    Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules.


    IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).
    Laser Bar or Touch Bar and other products are light and brittle, and it is easy to cause oxidation or damage due to improper operation. Under the fully automated operating system, there are strict requirements on packaging materials and boxes. The anti-static trays produced not only need to fully protect the products, but also need to deal with debugging such as the turnover of automatic equipment.At the same time in the process of transportation and transit also have high requirements, our company has accumulated a lot of experience in the production of such products, can fully respond to the diversified needs of customers, to provide set design.One - stop packaging solution production

    Advantages


    1. Light weight, saving transportation and packaging costs;
    2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine;
    3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
    4. High temperature resistance, suitable for high temperature automation equipment assembly;
    5. Corrosion resistance, suitable for all kinds of production conditions of products;
    6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
    7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement


    Outline SizeMaterialSurface ResistanceServiceFlatnessColor
    2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.2mmCustomizable
    3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.25mmCustomizable
    4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.3mmCustomizable
    Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMTBCCustomizable
    Provide professional design and packaging for your products
    UsagePackaging of Electronic Components,Optical device,
    FeatureESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
    MaterialMPPO.PPE.ABS.PEI.IDP...etc
    ColorBlack.Red.Yellow.Green.White and custom color
    SizeCustomized size, rectangle,circle shape
    Mold typeInjection Mold
    DesignOriginal sample or we can create the designs
    PackingBy Carton
    SampleSample time: after draft confirmed and payment arranged
    Sample charge: 1. Free for stock samples
    2. Custom Tray negotiated
    Lead Time5-7 Working days
    The exact time should according to the ordered quantity

    Product Application


    Wafer Die / Bar / Chips PCBA module component

    Electronic component packaging Optical device packaging



    Packaging


    Packaging Details:Packing according to customer's specified size

    FAQ


    Q: Can you do OEM and customized design IC tray?
    A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
    Q: How long is your delivery time?
    A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
    Q: Do you provide samples? is it free or extra?
    A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
    Q: What kind of Incoterm you can do?
    A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
    Q: What method you can help ship the goods?
    A: By sea, by air, or by express, by mail post according to customer order qty and volume.

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