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High Temperature Standard JEDEC Tray IC Packaging

Shenzhen Hiner Technology Co.,LTD
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    Buy cheap High Temperature Standard JEDEC Tray IC Packaging from wholesalers
     
    Buy cheap High Temperature Standard JEDEC Tray IC Packaging from wholesalers
    • Buy cheap High Temperature Standard JEDEC Tray IC Packaging from wholesalers
    • Buy cheap High Temperature Standard JEDEC Tray IC Packaging from wholesalers
    • Buy cheap High Temperature Standard JEDEC Tray IC Packaging from wholesalers

    High Temperature Standard JEDEC Tray IC Packaging

    Ask Lasest Price
    Brand Name : Hiner-pack
    Model Number : HN1809
    Certification : ISO 9001 ROHS SGS
    Price : $1.35~$2.38(Prices are determined according to different incoterms and quantities)
    Payment Terms : T/T
    Supply Ability : The capacity is between 2500PCS~3000PCS/per day
    Delivery Time : 5~8 working days
    • Product Details
    • Company Profile

    High Temperature Standard JEDEC Tray IC Packaging

    High Temperature Standard JEDEC Tray IC Packaging

    Discover JEDEC trays that offer the perfect fit, whether you’re packaging standard ICs or proprietary modules.


    The tray has a 45-degree chamfer to provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.


    Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.

    Advantage:

    1. Have exported for more than 12 years.
    2. Have a professional engineer and efficient management
    3. Delivery time is short, normally in stock.
    4. A small quantity is allowed.
    5. The best & professional sale services, 24hours Response.
    6. Our products have been exported to the USA, Germany, the UK, Europe, Korea, Japan, etc.
    7. The factory has an ISO certificate. The Product complies with the RoHS standard.

    Application:

    Electronic component, Semiconductor Embedded System, Display technology, Micro and Nano systems Sensor, Test and Measurement Technology, Electromechanical equipment and systems, Power supply.


    Technical Parameters:

    BrandHiner-packOutline Line Size322.6*135.9*7.62mm
    ModelHN1809Cavity Size19.0*6.0*2.2 mm
    Package TypeICMatrix QTY11*12=132PCS
    MaterialPPEFlatnessMAX 0.76mm
    ColorBlackServiceAccept OEM, ODM
    Resistance1.0x10e4-1.0x10e11ΩCertificateRoHS

    Reference to the temperature resistance of different materials:

    MaterialBake TemperatureSurface Resistance
    PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
    PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
    IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
    Color, temperature, and other special requirements can be customized


    FAQ


    Q1: Are you a manufacturer?
    A: Yes, we are a 100% manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.


    Q2: What information should we supply if we want a quotation?
    A: Drawing of your IC or component, Quantity, and size normally.
    Q3: How long could you prepare samples?
    A: Normally, 3 days. If customized, open a new mold 25~30 days around.
    Q4: How about batch order production?
    A: Normally, 5- 8 days or so.
    Q5: Do you inspect the finished products?
    A: Yes, we will do an inspection according to the ISO 9001 standard and be ruled by our QC staff.

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