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Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

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Shenzhen Hiner Technology Co.,LTD

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Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

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Brand Name :	Hiner-pack
Model Number :	*JEDEC standard tray 322.6135.97.62&12.19mm*
Certification :	ISO 9001 ROHS SGS
Price :	$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms :	T/T
Supply Ability :	The capacity is between 2500PCS~3000PCS/per day
Delivery Time :	5~8 working days

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Product Details
Company Profile

Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

Secure, stackable, and fully traceable, our JEDEC trays streamline logistics in fast-paced manufacturing environments.

JEDEC trays is a standard-defined tray for transporting, handling, and storing complete chips and other components,and the production come in the very same outline dimensions of 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm). Trays come in a number of different profiles.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.

Advantage:

1. Have exported for more than 12 years.
2. Have a professional engineer group and efficient management.
3. Delivery time is short, normally in stock.
4. A small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to the USA, Germany, the UK, Europe, Korea, Japan, etc.
7. The factory has an ISO certificate. The Product complies with the RoHS standard.

Application:

Electronic component; Semiconductor; Embedded System; Display technology; Micro and Nano systems; Sensor; Test and Measurement Technology; Electromechanical equipment and systems; Power supply

Technical Parameters:

Brand	Hiner-pack	Outline Line Size	322.6135.97.62mm
Model	HN1890	Cavity Size	681mm
Package Type	BGA IC	Matrix QTY	24*16=384PCS
Material	MPPO	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM, ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	RoHS

Reference to the temperature resistance of different materials:

Material	Bake Temperature	Surface Resistance
PPE	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Powder	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Glass Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
PEI+Carbon Fiber	Max 180°C	1.010E4Ω~1.010E11Ω
IDP Color	85°C	1.010E6Ω~1.010E10Ω
Color, temperature, and other special requirements can be customized

FAQ:

Q1: Are you a manufacturer?
Ans: Yes, we have an ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity, and size normally.
Q3: How long could you prepare samples?
Ans: Normally, 3 days. If customized, open a new mold 25~30 days around.
Q4: How about batch order production?
Ans: Normally, 5- 8 days or so.
Q5: Do you inspect the finished products?
Ans: Yes, we will inspect according to the ISO 9000 standard and be ruled by our QC staff.

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