ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging

Our waffle packs meet demanding semiconductor transport requirements with customizable layout, depth, and cavity count.

To better protect the components or chips, choosing injection trays for packaging has become an alternative and an option for a packaging solution. It can not only provide comprehensive protection for components, but also provide excellent products in terms of storage and transportation. The great advantage of convenience. At the same time, due to the reusable characteristics of plastic pallets, the products we produce can also be reused, and the waste of plastic after disposal can also be fully degraded, thereby eliminating some of the problems that need to be dealt with by environmental protection. Our company can provide one-stop service from design to production to packaging, solve all the problems faced by packaging for your parts, choose high-quality professional suppliers, and reduce unnecessary after-sales troubles for you.

Waffle Pack (IC Chip Tray), usually used for loading small chips or components less than 13mm, carrying a large number of chips in a small volume. At the same time, the purchase of inch products can match the corresponding accessories such as cover, clip, and Tyvek paper of the existing series, and the complete package is easier to transfer, transport, and store the products.

Application:

Wafer Die / Bar / Chips, PCBA module component, component packaging, Optical device packaging.

Advantages:

1. Flexible OEM service: We can produce products according to the customer’s sample or design.

2. Various Materials: The material can be MPPO, PPE, ABS, PEI, IDP, etc.

3. Complicated workmanship: tooling making, Injection molding, Production.

4. Comprehensive customer service: from customer consultation to after-sales service.

5. 12 years of experience in OEM for USA and EU customers.

6. We have our factory and can control quality at a high level and produce products quickly and flexibly.

Technical Parameters:

FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterms can you do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, by express, by mail post according to customer order quantity and volume.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/