High Temp JEDEC Tray with ESD Protection
This JEDEC tray is specially designed for high-temperature
semiconductor processes, including wafer baking, burn-in testing,
reflow soldering, and AI chip packaging. Made from premium PEI
material, it delivers exceptional dimensional stability and precise
chip positioning, ensuring seamless compatibility with automated
handling equipment throughout production, storage, and
transportation, while effectively protecting sensitive ICs, BGA
packages, and high-value AI chips from electrostatic damage.
Our JEDEC trays are manufactured in strict compliance with JEDEC
industry standards, featuring ultra-low warpage and long-term
dimensional accuracy even after repeated high-temperature cycles.
We offer free custom design services with a 24-hour turnaround for
non-standard sizes and configurations, supporting bulk orders with
fast lead times to meet the production needs of semiconductor
manufacturing enterprises.
Key Features/ Benefits
- Heat Resistance up to 150°C
- Stable ESD protection (1E4–1E11 Ω)
- Compatible with ASM / Advantest / YAMAHA machines
- Low Warpage & High Dimensional Stability
- JEDEC standard footprint
Specifications
| Brand | Hiner-pack |
| Model | HN24220 |
| Material | MPPO |
| Package Type | JEDEC |
| Color | Black |
| Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size | 322.6×135.9×7.62 mm |
| Cavity Size | 4x5x1.6 mm |
| Matrix QTY | 13x28=364 PCS |
| Warpage | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Custom Pocket Options | Available |
Applications
These trays are ideal for electronics manufacturing, assembly
lines, cleanroom environments, and automated handling systems.
Their versatility extends to acrylic tray displays and inventory
management applications.
- AI chips / GPU / ASIC
- BGA / QFN / IC packaging
- Burn-in & baking process
- Production line buffering
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials
with secure stacking and cushioning inserts. Customized packaging
solutions are available upon request. All shipments are tracked and
handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that
integrates Design, R&D, Manufacturing, Sales of IC packaging
and testing, as well as semiconductive wafer fabrication process in
automated handling, carrying, and transportation to provide
customers with turnkey services.
Why Choose Us:
- 10+ years semiconductor packaging experience
- In-house mold design capability
- OEM & ODM customization supported
- Consistent quality and stable supply
- Daily capacity: 2000+ pcs
