Stackable 2x2 Inch Waffle Pack Chip Trays With Secure Cover And
Clip Systems
The Integrated Waffle Pack Packaging System from Hiner-pack
represents a holistic approach to the secure storage and global
distribution of sensitive microelectronic components. Recognizing
that a tray is only as effective as the system that secures it,
this product line focuses on the seamless synergy between the
high-precision waffle pack chip tray, its corresponding covers, and
specialized retention clips. Each 2 times 2 inch tray is engineered
with a thin, space-saving profile that features a precision-molded
pocket matrix for bare die and chip-scale packages (CSPs).
This system is manufactured using electrically conductive or
antistatic polymers (ABS/PC) that ensure permanent protection
against electrostatic discharge throughout the entire stack. By
utilizing advanced Moldflow analysis during the design phase, we
ensure that the interlocking features of the trays and covers
maintain a high degree of flatness and mechanical alignment,
preventing components from migrating between pockets or being
crushed during the rigors of international transit.
Key Features/ Benefits
Holistic Stackable Design
Complete Closure with Top Covers
Universal Clip System Compatibility
Permanent ESD and RoHS Integrity
High Precision and Flatness Control
Dust-Free Cleanroom Packaging
Specifications
| Brand | Hiner-pack |
| Model | HN24094 |
| Material | ABS |
| Tray Type | 2-inch Waffle Pack |
| Color | Black |
| Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size | 50.8x50.8x4mm |
| Cavity Size | 4.95x2.2x1.16mm |
| Matrix QTY | 14X7=98PCS |
| Warpage | MAX 0.2mm |
| Service | Accept OEM, ODM |
| Certifications | RoHS, ISO |
Applications
This system-level solution is the standard for End-to-End
Microelectronic Logistics. Its primary applications include:
International Component Shipping, where the combination of
stackable trays and clips provides the necessary durability for
long-distance air and sea freight; Automated Tray Handling Systems,
where the consistent dimensions and flatness of the stack allow for
reliable machine gripping and feeding; and Cleanroom Inventory
Management, providing an organized, dust-free method for storing
large volumes of bare die or optical elements. It is also an ideal
choice for Field Service Kits, where technicians require a compact
and secure way to carry sensitive replacement parts. By offering a
complete supply base of accessories, we ensure that our customers
have a one-stop solution for managing their most fragile
microelectronic assets from the production line to the final user.
Customization
Customization of the waffle pack system extends beyond the tray
geometry to the entire packaging assembly. We can design
Custom-Height Stacks and specialized covers that accommodate taller
components or those with unique surface protrusions. Our
engineering team can also provide Custom-Colored Trays and Covers
for rapid visual identification of different product grades or
process stages. Furthermore, we offer the ability to add Laser
Engraving or Molded Identification Marks on both the trays and the
covers for enhanced traceability. With existing designs, we can
rapidly configure a "tray + cover" combination that meets your
specific process requirements, often delivering custom-tooled
solutions in as little as 3 to 4 weeks, ensuring your unique
components are supported by a tried and true technology.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that
integrates Design, R&D, Manufacturing, Sales of IC packaging
and testing, as well as semiconductive wafer fabrication process in
automated handling, carrying, and transportation to provide
customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
