High Purity Cleanroom Compatible ESD Safe Waffle Pack Trays For
Sensitive Optoelectronic Devices
In the specialized world of photonics and micro-optics, the
cleanliness of the packaging environment is as critical as the
protection from physical shock. This series of high-purity waffle
pack chip trays is specifically engineered for the handling and
transport of sensitive optoelectronic devices and optical elements.
Unlike standard carriers, these trays are manufactured using
specialized, non-sloughing, carbon-powder-free polymers. This
material selection is vital because it prevents the release of
microscopic particles that could contaminate delicate lenses,
mirrors, or sensor surfaces.
Key Features/ Benefits
Specifications
| Brand | Hiner-pack |
| Model | HN24081 |
| Material | ABS |
| Tray Type | 2-inch Waffle Pack |
| Color | Black |
| Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size | 50.7x50.7x4mm |
| Cavity Size | 1.32x1.91x0.56mm |
| Matrix QTY | 23x18=400PCS |
| Warpage | MAX 0.2mm |
| Service | Accept OEM, ODM |
| Certifications | RoHS, ISO |
Applications
These high-purity waffle trays are the primary choice for the
Photonics and Optical Communications industries. Their application
is focused on protecting components where surface contamination is
a failure mode. Typical use cases include: Laser Diode Packaging,
where cleanliness and ESD safety are paramount; CMOS and CCD Sensor
Handling, preventing dust particles from settling on the imaging
area; Micro-Lens Array Storage, ensuring fragile glass or plastic
optics are not scratched or contaminated; and Scientific Research
R&D, providing a reliable carrier for experimental
micro-components. They are also widely used in Automated Optical
Inspection (AOI) workflows, where the tray’s high precision ensures
that the automated cameras can maintain focus across the entire
pocket matrix. Whether for internal transport or global shipping,
these trays safeguard the integrity of high-value optical assets.
Customization
Customization for optoelectronic applications involves a deep
understanding of component sensitivity. We provide Full Geometry
Optimization, allowing for the creation of pockets with specific
"no-touch" zones to protect delicate optical features. Trays can be
molded in specific colors to help with part identification or to
minimize light reflection during inspection. We offer material
choices ranging from Antistatic PC for higher rigidity to
high-temperature versions for components that must undergo thermal
curing or stabilization. Our engineering team can add reference
marks or fiducials directly into the mold to assist with high-speed
automated alignment. We can design and deliver a fully custom mold
in as little as one month, ensuring your specialized optics are
handled with the highest degree of precision.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that
integrates Design, R&D, Manufacturing, Sales of IC packaging
and testing, as well as semiconductive wafer fabrication process in
automated handling, carrying, and transportation to provide
customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
