Stackable Impact Resistant Conductive Waffle Pack Chip Trays For
Fragile Component Shipping
The "waffle" design is not merely a naming convention; the internal
matrix of separator ribs functions as a high-precision structural
grid that significantly increases the tray's mechanical rigidity.
When multiple trays are stacked, these ribs align to create a
series of reinforced vertical pillars, distributing external
crushing forces across the entire stack rather than onto the
fragile components within. Constructed from permanently conductive
ABS or PC resins, these trays provide a dual layer of protection:
safeguarding against electrostatic discharge (ESD) while providing
a robust physical shield. By utilizing advanced Moldflow analysis,
we ensure that the tray wall thickness and rib height are optimized
for maximum strength-to-weight ratio. This ensures that your bare
die, chip-scale packages (CSPs), and high-value 2.5D components
remain securely seated and entirely isolated from external
mechanical stress, ensuring they arrive at their destination in
factory-perfect condition.
Key Features/ Benefits
Multi-Ribbed Structural Reinforcement
Impact-Absorbent Conductive Polymers
Permanent, Non-Degrading ESD Shielding
Precision Stackable Interlock System
Cleanroom-Compatible Purity
Specifications
| Brand | Hiner-pack |
| Model | HN24130 |
| Material | ABS |
| Tray Type | 2-inch Waffle Pack |
| Color | Black |
| Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size | 50.8x50.8x4mm |
| Cavity Size | 1.75×1.2×0.35mm |
| Matrix QTY | 10X10=100PCS |
| Warpage | MAX 0.2mm |
| Service | Accept OEM, ODM |
| Certifications | RoHS, ISO |
Applications
This series is the industry standard for Cross-Border Semiconductor
Distribution and secure component transit. Its primary applications
include: International Shipping of Bare Die, where the risk of
mechanical damage is highest; Logistics for High-Value
Optoelectronics, providing a stable and crush-proof environment for
fragile lenses; and Inter-Facility Component Transfer, where trays
are moved between different manufacturing and testing sites. The
robust design also makes them suitable for Field Service and Repair
Kits, where replacement micro-parts must be carried safely in
uncontrolled environments. Because they utilize the unofficial
industry-standard 2-inch footprint, they integrate seamlessly into
all global microelectronic supply chains, compatible with existing
covers, clips, and automated handling interfaces.
Customization
We provide specialized engineering services to optimize our trays
for your specific logistics challenges. Customization options
include Reinforced External Wall Thickness for even higher crush
resistance and Tailored Pocket Depths to accommodate thicker
components while maintaining stack stability. Our team can also
design Custom Stacking Configurations and specialized covers for
non-standard heights. We offer a variety of material grades,
including specific conductive colors for easy shipment
identification. With a library of existing designs, we can rapidly
find a structural match for your components, or we can develop a
completely new mold in as little as 3 to 4 weeks, ensuring your
global shipping needs are met with a precision-engineered solution.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that
integrates Design, R&D, Manufacturing, Sales of IC packaging
and testing, as well as semiconductive wafer fabrication process in
automated handling, carrying, and transportation to provide
customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
