2 Inch Waffle Pack Chip Trays For Accurate Microelectronic
Component Alignment
The High Precision Waffle Pack Chip Tray series is the cornerstone
of reliable microelectronic component management, specifically
designed for applications where dimensional accuracy is
non-negotiable. While many generic carriers suffer from microscopic
warping, our 2-inch format trays are engineered to maintain an
absolute planar degree throughout their operational lifecycle.
The secret to this stability lies in our advanced manufacturing
workflow, which begins with comprehensive Moldflow analysis. By
simulating the injection molding process before the first tool is
ever cut, our engineers can precisely predict and mitigate
potential shrinkage or stress points. This data-driven approach
ensures that the uniform pocket matrix remains perfectly aligned
with the tray’s external dimensions, creating a predictable
interface for both manual inspection and automated handling
systems.
Constructed from electrically conductive ABS or PC resins, these
waffle packs provide the essential electrostatic discharge (ESD)
protection required for sensitive bare die and chip-scale packages
(CSPs). The tray's design features a regular pattern of separator
ribs that define each pocket, ensuring that even the most fragile
2.5D components are cradled in a secure, movement-free environment.
For standard workflows, these trays offer a cost-effective,
high-precision solution that adheres to the unofficial industry
standards for small-format microelectronics.
Key Features/ Benefits
Advanced Moldflow Optimization
Superior Dimensional Tolerance
Permanent ESD Protection
Material Selection for Stability
Industry-Standard 2×2 Inch Footprint
Stackable Security
Specifications
| Brand | Hiner-pack |
| Model | HN24109 |
| Material | ABS |
| Tray Type | 2-inch Waffle Pack |
| Color | Black |
| Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size | 50.7x50.7x4mm |
| Cavity Size | 2.93x1.60x0.61mm |
| Matrix QTY | 13X20-10=250PCS |
| Warpage | MAX 0.2mm |
| Service | Accept OEM, ODM |
| Certifications | RoHS, ISO |
Applications
These high-precision carriers are optimized for Back-End
Semiconductor Processes where alignment is a primary concern. Key
applications include: High-Speed Die Sorting, where the tray’s
flatness prevents machine "miss-picks"; Manual and Automated
Inspection, providing a stable focal plane for optical equipment;
and Kitting for Prototype Assembly, where small quantities of
diverse die must be organized and protected. Because of their
stable size and reliable protection, they are also widely adopted
in Aerospace and Defense microelectronics, where component
traceability and physical security are paramount. Whether handled
manually in an R&D lab or fed into an automated assembly line,
these waffle packs ensure your components remain exactly where they
belong.
Customization
We provide deep customization capabilities to adapt our trays to
your specific process constraints. Our engineering team can
optimize Pocket Geometry, including adding tapered walls or
specialized corner relief cuts to accommodate specific component
features like solder balls or sensitive pads. While standard trays
are for ambient use, we can discuss Material Upgrades based on your
environmental needs, choosing between various conductive resins or
specialized colors for lot tracking. Customization also extends to
the inclusion of Reference Marks or Fiducials molded directly into
the tray frame to improve the speed and reliability of automated
alignment tools.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that
integrates Design, R&D, Manufacturing, Sales of IC packaging
and testing, as well as semiconductive wafer fabrication process in
automated handling, carrying, and transportation to provide
customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
