High Temperature JEDEC Tray Secure And Stackable IC Tray Design For Bake Oven

This ESD-Safe JEDEC Tray is specifically designed for the protection and handling of semiconductor devices across automated manufacturing lines. Built from high-performance conductive polymer, it ensures stable electrostatic control while maintaining precise pocket geometry for secure part retention. Its rigid structure and uniform layout provide reliable compatibility with robotic arms, pick-and-place systems, and tray elevators, making it an ideal solution for high-volume, precision-driven production environments.

Features & Benefits:

JEDEC Standard Compliance – Fully meets JEDEC outline specifications to ensure interchangeability with global handling and packaging systems.

Excellent ESD Protection – Conductive material effectively dissipates static charges, protecting sensitive components during every stage of handling.

Precision-Molded Pockets – Consistent pocket design minimizes component movement, ensuring accurate placement during transport or inspection.

Automation Adaptability – Compatible with robotic sorting systems and tray stackers to streamline automated workflows.

Reinforced Frame Design – Strengthened edges reduce flexing and warping, maintaining dimensional accuracy through repeated cycles.

Stacking Efficiency – Interlocking edges enable stable vertical stacking, simplifying storage and transport logistics.

Technical Parameters:

Applications:

Customization:

This tray can be modified to accommodate unique device specifications or process needs:

Custom Pocket Geometry – Designed for chips, modules, or special-shaped components requiring non-standard cavity profiles.

Color Options – ESD-safe materials can be customized in various colors for product or batch distinction.

Permanent Marking Options – Incorporate molded batch codes, serial numbers, or customer logos for traceability.

Automation Interface Options – Optional indexing holes, tabs, or side cutouts for enhanced robotic or conveyor integration.