Product Description:

As a prominent player in the field of semiconductor packaging and testing, our company has introduced the groundbreaking Die Carrier Series, specifically designed to meet the stringent requirements of cutting-edge semiconductor production. In line with the global Semiconductor industry's trend towards smaller footprints and increased integration, we have gained a thorough understanding of the stringent market standards for chip packaging solutions, leading to a diverse range that accommodates chips of varying dimensions. Our offering features lasting antistatic characteristics, resistance to dust, and robust longevity, coupled with exceptional dimensional accuracy. It provides superior protection for semiconductors during repeated handling and application processes, thereby guaranteeing consistent and reliable product performance.

Features:

• Product Name: Bare Die Trays
• Heat Resistant: Yes
• Flatness: Max 0.3mm
• Number Of Cavities: 10X11=110pcs

Technical Parameters:

Applications:

♦Chip Transportation and Distribution:

the bare die tray can effectively protect the chips during transportation, reducing the risk of chip failure due to physical damage or electrostatic discharge.

♦Multi-process Production Line Transfer

The modular structure design supports full-process carrying from R&D sampling to mass production, compatible with strict environmental requirements of Class 5 cleanrooms.

FAQ:

Q: What certifications do the Bare Die Trays have?
A: The Bare Die Trays are certified with ISO 9001, ROHS, and SGS.

Q: What is the minimum order quantity for the Bare Die Trays?
A: The minimum order quantity is 1000 pieces.