Customized Metal 6 8 12 inch Semi Wafer Dicing Frame Ring Metal Ring Wafer Frame

6" 8" 12" High Quality Custom Wafer Frame Dicing Ring for Semiconductor Industry

This wafer ring with its high-quality aluminum alloy material, precise processing technology, and strict quality control, has reached industry-leading levels in durability, positioning accuracy, and safety of use.

Semi-Wafer Cutting Frame Ring

(1)This wafer dicing frame is made of high quality aluminum alloy for excellent durability and stability. Precision-machined slots reliably hold the 6-inch wafer in place, ensuring positional accuracy during cutting and transportation.

(2)The lightweight design facilitates handling and provides good anti-static protection, suitable for the semiconductor and electronics industry processes.

Why Do We Choose Wafer Frame Flex Rings?

1.Material
The taut ring is mainly made of high-strength aluminum alloy, with excellent resistance to deformation and corrosion resistance.
Individual models are also made of stainless steel to further improve wear resistance.

2.Sizes
The standard size of the bandage ring includes 6 inches, 8 inches and 12 inches, etc., can be applied to different specifications of the wafer. Each size of the bandage ring has a corresponding outer diameter and inner diameter size, to ensure a perfect match with the process equipment.

3. Structural design
The taut ring adopts patented multi-stage structure, which improves the overall rigidity and stability.
Precision positioning slots are provided inside to reliably fix the wafers and prevent them from shifting during transportation.
The surface is anodized to provide good anti-static and wear resistance.

4. Performance indicators
The maximum load capacity of the ring is up to 20kg, which is sufficient to support the weight of large-sized wafers.
Can withstand -40 ° C to 125 ° C working temperature range, suitable for all kinds of semiconductor manufacturing environment.
Conforms to SEMI international standards, ensuring full compatibility with mainstream equipment in the industry.

5.Production process
High-precision CNC machining and automated assembly processes are used to ensure product consistency and quality stability.
Each batch of products has to go through strict quality inspection and function test before leaving the factory.

Certificates and patents:

1. ISO 9001 Quality Management System Certification

2.SEMI Standard Certification

3. ESD (electrostatic discharge) protection level certification

4.RoHS Certification

5.CE certification

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/