PC Small Cavity Tray For Safe Transport Of Semiconductor Bare Dies

Whether you need to package chips, dies, COG, or other microelectronic components, the Bare Die Tray series is designed to provide a safe and efficient solution. With options available in multiple sizes and materials like Antistatic / Conductive ABS and PC, these trays offer a reliable way to transport sensitive items. In addition to the standard 2-inch and 4-inch specifications, customization is also an option to cater to individual customer needs.

Features:

Made from ESD-safe, non-sloughing, and carbon-powder-free clean polymers, these products are designed to meet industry standards for safety and cleanliness.

They are reinforced with carbon fiber for added strength and long-lasting electrostatic discharge (ESD) protection. You can trust in the durability and reliability of these materials.

These products can withstand bake temperatures of up to 180°C, making them suitable for a variety of applications that require heat resistance.

Available in industry-standard formats, these products can also be customized to meet your specific needs and requirements. Get the perfect solution tailored just for you.

Technical Parameters:

Specifications:

The external dimensions of waffle pack chip trays are well established: 2-inch is two inches square, 4-inch is four inches square, and so on. The variability is in the pocket size, geometry and count.

Waffle pack trays are usually specified by a few characteristics.

• External size – 2”, 4”, etc.
• Pocket size or pocket count – choosing one will dictate the other
• Temperature rating – the maximum temperature at which the tray will be used

Custom waffle pack trays require additional specification.

• Component geometry
• Special process requirements
• Quantity of trays needed or quantity of components that will be processed (this helps determine the appropriate manufacturing process to be used for tray manufacturing)