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Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components

Shenzhen Hiner Technology Co., Ltd.
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    Buy cheap Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components from wholesalers
     
    Buy cheap Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components from wholesalers
    • Buy cheap Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components from wholesalers
    • Buy cheap Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components from wholesalers
    • Buy cheap Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components from wholesalers
    • Buy cheap Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components from wholesalers

    Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components

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    Brand Name : Hiner-pack
    Model Number : HN24122
    Certification : ISO 9001 ROHS SGS
    Price : $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
    Delivery Time : 5~8 Working Days
    Payment Terms : T/T
    Supply Ability : 4000PCS~5000PCS/per Day
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    Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components

    Product Description:

    Bare Die Trays are a preferred option due to their compact size. For small die, chip scale packages (CSP), and similar-sized components, when a full-size JEDEC matrix tray would be too bulky, bare die trays provide comparable industry acceptance and component protection in a more space-efficient form.

    Bare die trays can be stacked to create protective compartments for your parts. Their small size makes them easy to package and transport efficiently.

    These trays are favored for manual loading and unloading, and there are also commercial feeders available. In addition, we design JEDEC matrix trays that can function as "adaptors" for processing bare die trays through JEDEC tray feeders and handlers.

    Features:

    • Trays are made from premium materials like conductive plastics and non-conductive polymers to prevent ESD damage and ensure durability, particularly safeguarding bare dies from common hazards in the semiconductor industry. Each tray is customized to specific dimensions to accommodate different bare die sizes.
    • The tray's pocket securely holds the dies in place, reducing the risk of motion or damage while in use.
    • Die trays are designed for a wide range of die sizes, from small microchips to large integrated circuits. Various tray designs cater to the diverse needs and innovative requirements in the industry.
    • Protective casings are crucial in semiconductor manufacturing and assembly processes, providing individual bare die protection during transportation or storage. They are also stackable to optimize space efficiency. Stacked trays can be conveniently stored in a corner, minimizing the risk of loss or misplacement.

    Technical Parameters:

    HN24122 Technical Data Ref.
    Base InformationMaterialColorMatrix QTYPocket Size
    ABSBlack15*18=270PCS3.92*3.02*1.10mm
    SizeLength * Width * Height (according to customer's requirement)
    FeatureDurable;Reusable;Rcofriendly;Biodegradable
    SampleA. The free samples: Chosen from existing products.
    B. Customized samples as per your design/demand
    AccessoryCover/Lid, Clip/Clamp, Tyvek paper
    Artowrk FormatPDF,2D,3D

    Customization:

    Unlike standard bare die trays typically found in catalogs or on distributor shelves, we produce custom bare die trays tailored to the specific dimensions of your components. The trays are molded from materials chosen to meet your requirements and feature custom options like component support features, temperature rating, color choices, engraving, reference marks, and fiducial, as well as variations in size or thickness.

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