Product Description:

Bare Die Trays are highly sought after due to their compact size. They are particularly favored for small die, chip scale packages (CSP), and components of similar sizes. In situations where a standard JEDEC matrix tray would be too large, bare die trays offer a smaller yet equally protective option that is widely accepted in the industry.

When stacked, bare die trays create individual compartments that safeguard your parts. Their small dimensions also make them convenient for packaging and transportation purposes.

Bare die trays are well-suited for manual loading and unloading tasks, and there are commercial feeders available for automated processes. Additionally, we manufacture JEDEC matrix trays that can act as "adaptors" to accommodate bare die trays in JEDEC tray feeders and handlers.

Features:

• Trays are made using top-quality materials like conductive plastics and non-conductive polymers, which help prevent ESD damage and ensure durability. These trays are customized to fit specific dimensions for each bare die size, protecting them from common ESD hazards found in the semiconductor industry.
• The tray's pocket assists in shaping it to securely hold the bare dies without any movement or damage during use.
• Die trays are designed for a wide range of die sizes, from small microchip dimensions to large integrated circuits. Each tray design caters to the diverse facets and innovative requirements of the industry.
• Protective casings are crucial for semiconductor manufacturing and assembly processes, providing individual bare die protection during transport and storage. These trays are stackable to optimize space utilization, with the ability to conveniently store them in corners. Moreover, their design enhances storage utility and reduces the chances of loss or misplacement.

Technical Parameters:

Customization:

Our custom bare die trays are tailored to fit your specific requirements.

We offer trays molded from materials selected to meet your needs, with customizable features such as:

• component support
• temperature ratings
• color choices
• engraving options
• reference marks
• fiducials
• special sizes or thicknesses