Product Description:

The Chip Tray & Waffle Pack series from Hiner-pack offers a safe and convenient solution for packaging and transporting Chip, Die, COG, Optoelectronic devices, and other microelectronic components. The products come in multiple sizes and materials, including 2 inches, 3 inches, and 4 inches. The materials available are Antistatic/Conductive ABS and PC, and can be customized to meet specific customer requirements.

At Hiner-pack, we provide a variety of sizes and styles of molds for Chip Tray & Waffle Pack, with high demands for product size and flatness. Our process begins with the imported Moldflow analysis for product mold design, allowing us to accurately control product size precision and flatness based on material properties, mold structure, and injection molding conditions. This ensures that we meet the quality standards set by our customers.

Features:

• Permanent Antistatic, in accordance with ESD and RoHS environmental standards.
• By collaborating with automation, the goal is to enhance product yield and production efficiency.
• Stable size and high precision enable safe transportation of the products without risk of being crushed.
• Products receive dust-free cleaning packaging after forming, making them suitable for class 10-1000 cleanrooms.
• We can customize the design style and size based on the specific requirements of our customers.

Technical Parameter:

Support and Services:

We have the capability to create custom trays from scratch and deliver them within just three weeks, meeting the strict quality standards of microelectronic and various other industries. These trays play a crucial role in safeguarding, automating, storing, and shipping a diverse range of products.

The utility of our custom packaging trays goes well beyond the realm of the semiconductor industry. They find applications in situations where managing an inventory of small items is essential, such as in the medical field for parts, gems, springs, screws, watch components, and more. These device trays are specifically crafted to work seamlessly with manual or automated tool handling systems, ensuring reliable performance and high-level protection for devices, all while reducing shipping and storage expenses.